It’s like responding to your employee losing an arm, ripped off by your tiger, and saying “I’m never going to financially recover from this.”

Basically they’d need about as much in radiator fin surface area as they would have in solar panel area. The ISS has 8 solar array wings, 35m x 12m, that can produce about 30 kW each, or 240 kW total, in sunlight (which is only half the time). The ISS has a complex cooling system, but relies on 4 radiators about 3.1 m x 13.6 m to reject up to 14 kW of heat each (56 kW total) for cooling the solar arrays themselves. The main cooling system uses 6 radiators, each 23.3 m x 3.4 m, to reject 70 kW of heat (from this report it sounds like each radiator may be capable of rejecting more than 1/6 of the heat but that the system as a whole needs to be kept under 70 kW of heat rejection).

So that seems like about 650 square meters of radiators can provide about 120 kW of heat rejection.

Today, a 72-GPU Blackwell server is 130 kW in a single server rack. The next generation rolling out now has 72 Rubin GPUs in a 230 kW server, in a single rack. And that’s not even a “data center.” That’s just a single (albeit very powerful) server. How many can you string together, with networking equipment beaming data connections back down to the ground, before the ratio of solar panels and radiators to the actual ship size becomes unworkable?

That said, it’s technically possible, especially if you can radiate the heat at higher temperatures than the ISS does, as the Stefan-Boltzmann law shows that the hotter the radiator, the more heat it can reject. Just completely infeasible from an engineering and economical standpoint, for any data center that hopes to be relevant in an age of 100+ MW data centers.

No, the article is saying that it is why these robots were popular. Because unlike a human delivery person, there was no tip expected for the robots.

Yeah, it wouldn’t be copyright. It might be trade secrets, though. And trade secrets can be made out of public data, but arranged in a way that gives competitive advantage (for example, customer lists themselves might be trade secrets, even if each entry is a publicly available set of name/contact information/job title/company).

The actual process of creating semiconductors is basically:

1. Etch a stencil that has the pattern you want.
2. Place the stencil over a piece of silicon.
3. Bombard the silicon and stencil with radiation so that the chemical properties of the silicon change exactly under that stencil.
4. Repeat the process with multiple other stencils, so that the resulting silicon has basically shapes of wires and logic gates that can perform different functions with the electricity running through those shapes.

In recent years, step 3 has gotten so complicated, based on needing to create radiation of exactly a particular wavelength of extreme ultraviolet light focused exactly on the silicon (and the mask/stencil above it), because that wavelength allows for the smallest possible features on the silicon. So they take purified tin, melt the tin into molten liquid, and ejecting the molten tin in a liquid jet downward into a vacuum at exactly the right speed to where it forms into droplets of the exact size for the machine (about 50 μm), then blasts each droplet, mid-fall, with a 1.6kW laser that heats it up so hot that it vaporizes and ionizes into plasma at the exact position where a system of highly polished and precisely positioned mirrors focuses the UV radiation evenly onto the silicon surface.

Oh, and the machine makes one tin droplet every 1/50,000 of a second, so in any given second it ionizes 50,000 droplets in the stream.

The machine costs something like $300 million, and requires full time experts to make sure that it’s working correctly.

Everything else in the fabrication facility is similarly complicated, which is why a fab represents something like $30 billion in total costs over its lifetime.